Alumina ceramic substrate

The ultraviolet transmittance exceeds 80%, precisely supporting UV bond breaking.

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- Commodity name: Alumina ceramic substrate
The ultraviolet transmittance exceeds 80%, precisely supporting UV bond breaking.

Features
1. The ultraviolet transmittance exceeds 80%, precisely supporting UV bond breaking.
2. The thermal conductivity reaches 30W/(m·K), completely releasing the heat dissipation performance.
3. The CTE matches perfectly with the silicon wafer, solving the problem of thermal mismatch.
4. The bending strength is 380MPa and the Young's modulus is 390GPa, ensuring zero deformation during the processing of ultra-thin wafers.
5. Specifically customized for advanced packaging technologies such as FOWLP, directly improving the yield of the production line and the thermal management capability of heterogeneous integration.
Application
Semiconductor packaging
Electronic circuit substrate
Infrared thermal imaging window
LED packaging

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U-Type ALN Ceraimic

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Alumina ceramic substrate

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